App.:Digital Electronics

Thickness:0.8mm

Surface treatment:ENIG+OSP

Material:FR4 TG150

Layer:8L HDI(2+4+2)

Location:INDEX > PROFILE > Equipment
  • LAY-UP Line

  • Mitsubishi Laser dilling machine

  • Mitsubishi Laser dilling machine

  • Lamination

  • CNC Drilling

  • Exposure&LDI

  • VCP

  • Desmear&PTH

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